UNLIMITED FREE ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Select Your Free Newsletters

Industry Newsletters

Select Your Free Product Alerts

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

IEC/TS 62647-2

Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 2: Mitigation of deleterious effects of tin

active, Most Current
Buy Now
Organization: IEC
Publication Date: 1 November 2012
Status: active
Page Count: 72
ICS Code (Production. Production management): 03.100.50
ICS Code (Electronic components in general): 31.020
ICS Code (Aerospace electric equipment and systems): 49.060
scope:

This Technical Specification establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems.

This Technical Specification is applicable to aerospace, defence, and high performance (ADHP) electronic applications which procure equipment that may contain Pb-free tin finishes.

This document may be used by other high-performance and high-reliability industries, at their discretion.

Document History

IEC/TS 62647-2
November 1, 2012
Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 2: Mitigation of deleterious effects of tin
This Technical Specification establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems. This Technical Specification is...
IEC/PAS 62647-2
June 1, 2011
Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 2: Mitigation of the deleterious effects of tin
This PAS establishes processes for documenting the mitigating steps taken to reduce the harmful effects of tin finishes in electronic systems. This PAS is applicable to Aerospace and High...

References

This document references:
IEC/TS 62647-21 - Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 21: Program management – Systems engineering guidelines for managing the transition to lead-free electronics
Published by IEC on July 1, 2013
This part of IEC 62647 is designed to assist program management and/or systems engineering management in managing the transition to lead-free (Pb-free) electronics to assure product reliability and...
This document references:
IEC/TS 62647-22 - Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 22: Technical guidelines
Published by IEC on September 1, 2013
This part of IEC 62647 is intended for use as technical guidance by aerospace, defence, and high performance (ADHP) electronic applications and systems suppliers, e.g., original equipment...
This document references:
IEC 62239-1 - Process management for avionics – Management plan – Part 1: Preparation and maintenance of an electronic components management plan
Published by IEC on September 1, 2018
This part of IEC 62239 defines the requirements for developing an electronic components management plan (ECMP) to guarantee to customers that all of the electronic components in the equipment of the...
This document references:
IEC/TS 62647-1 - Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 1: Preparation for a lead-free control plan
Published by IEC on August 1, 2012
This part of the IEC/TS 62647 series defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that ADHP electronic systems containing...
This document references:
ASQ Z1.4 - SAMPLING PROCEDURES AND TABLES FOR INSPECTION BY ATTRIBUTES
Published by ASQ on January 1, 2003
PURPOSE. This publication establishes sampling plans and procedures for inspection by attributes. When specified by the responsible authority, this publication shall be referenced in the...
This document references:
IEC 61086-1 - Coatings for loaded printed wire boards (conformal coatings) Part 1: Definitions, classification and general requirements
Published by IEC on January 1, 2004
This part of IEC 61086 gives the definitions, classification and general requirements for electrical insulating materials suitable for application as coatings for loaded printed wire boards...
This document references:
IEC 62239-1 - Process management for avionics – Management plan – Part 1: Preparation and maintenance of an electronic components management plan
Published by IEC on September 1, 2018
This part of IEC 62239 defines the requirements for developing an electronic components management plan (ECMP) to guarantee to customers that all of the electronic components in the equipment of the...
This document references:
IEC/TS 62647-1 - Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 1: Preparation for a lead-free control plan
Published by IEC on August 1, 2012
This part of the IEC/TS 62647 series defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that ADHP electronic systems containing...
This document references:
IEC/TS 62647-22 - Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 22: Technical guidelines
Published by IEC on September 1, 2013
This part of IEC 62647 is intended for use as technical guidance by aerospace, defence, and high performance (ADHP) electronic applications and systems suppliers, e.g., original equipment...
This document references:
IEC/TS 62647-21 - Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 21: Program management – Systems engineering guidelines for managing the transition to lead-free electronics
Published by IEC on July 1, 2013
This part of IEC 62647 is designed to assist program management and/or systems engineering management in managing the transition to lead-free (Pb-free) electronics to assure product reliability and...
This document is referenced by:
BS DD IEC TS 62239 - Process management for avionics Preparation of an electronic components management plan
Published by BSI on August 14, 2003
A description is not available for this item.
This document is referenced by:
BS PD IEC/TS 62647-21 - Process management for avionics — Aerospace and defence electronic systems containing lead-free solder Part 21: Program management — Systems engineering guidelines for managing the transition to lead-free electronics
Published by BSI on August 31, 2013
A description is not available for this item.
This document is referenced by:
IEC/TS 62647-23 - Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
Published by IEC on October 1, 2013
This part of IEC 62647 provides technical background, procurement guidance, engineering procedures, and guidelines to assist organizations reworking/repairing aerospace and high performance...
View Less
View All
Advertisement