scope:

This part of IEC 60749 establishes a standard procedure for testing and classifying semiconductor devices according to their susceptibility to damage or degradation by exposure to a d efined m achine m odel (MM) electrostatic d ischarge (ESD). It may be u sed as an alternative test method to the human body model ESD test method. The o bjective is to provide reliable, repeatable ESD test results so that accurate classifications can be performed.

This test method is applicable to all semiconductor devices and is classified as destructive.

ESD t esting of semiconductor devices i s selected from this test method, the human b ody model (HBM - see IEC 60749-26) or other test methods in the IEC 60749 series. The MM and HBM test methods produce similar but not identical results. Unless otherwise specified, the HBM test method is the one selected.

NOTE 1 This test method does not truly simulate discharge f rom real machines or m etallic tools because the test method uses high parasitic i nductance of the test circuit, whereas real machines and metallic tools, whose discharge rise time is approximately 100 ps, have no inductance.

NOTE 2 Certain clauses in this test method are in accordance with IEC 61340-3-2.