JEDEC JEP 170
Guidelines for Visual Inspection and Control of Flip Chip Type Components (FCxGA)
Organization: | JEDEC |
Publication Date: | 1 January 2013 |
Status: | active |
Page Count: | 18 |
scope:
This publ impact en considere products. or visual n in actual p lication prov nd-user produ d visual nonc Finally, it w nonconformit product drawi ides descript cts and/or app conformities s ill depict a m ties and guida ings and spec tion of defec plications. It since they sho method for visu ance for dispo cifications. ts observed will also prov ould be less d ual inspection osition. Offic in FCxGA c vide illustrati disruptive of q n that can be u cial criteria fo components t ion on other d quality or reli utilized to ide or product acc that can adve defects that m ability to cus entify these d ceptance shou ersely may be tomer defects uld be
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