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JEDEC JEP 170

Guidelines for Visual Inspection and Control of Flip Chip Type Components (FCxGA)

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Organization: JEDEC
Publication Date: 1 January 2013
Status: active
Page Count: 18
scope:

This publ impact en considere products. or visual n in actual p lication prov nd-user produ d visual nonc Finally, it w nonconformit product drawi ides descript cts and/or app conformities s ill depict a m ties and guida ings and spec tion of defec plications. It since they sho method for visu ance for dispo cifications. ts observed will also prov ould be less d ual inspection osition. Offic in FCxGA c vide illustrati disruptive of q n that can be u cial criteria fo components t ion on other d quality or reli utilized to ide or product acc that can adve defects that m ability to cus entify these d ceptance shou ersely may be tomer defects uld be

Document History

JEDEC JEP 170
January 1, 2013
Guidelines for Visual Inspection and Control of Flip Chip Type Components (FCxGA)
This publ impact en considere products. or visual n in actual p lication prov nd-user produ d visual nonc Finally, it w nonconformit product drawi ides descript cts and/or app conformities s ill...

References

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