DS/EN 60249-2-11 + A2,3
Base materials for printed circuits - Part 2: Specifications - Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards
inactive
| Organization: | DS |
| Publication Date: | 16 February 1996 |
| Status: | inactive |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
Gives requirements for properties of thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards. Laminated sheets covered by this specification have thicknesses (of the base laminate, excluding the copper foil) not greater than 0.8 mm (0.031 in). The sheet consists of an insulating base (epoxide resin bonded woven glass fabric laminate) with metal foil bonded to one or both sides. This publication supersedes IEC 249-2C (1973).
Document History
October 15, 2001
Base materials for printed circuits - Part 2: Specifications - Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards
Gives requirements for properties of thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards. Laminated sheets...
DS/EN 60249-2-11 + A2,3
February 16, 1996
Base materials for printed circuits - Part 2: Specifications - Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards
Gives requirements for properties of thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards. Laminated sheets...
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