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IPC-TR-579

Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards

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Organization: IPC
Publication Date: 1 September 1988
Status: active
Page Count: 90
scope:

Objective

The "Round Robin Reliability Evaluation of Small Diameter Plated Through Holes (PTH) in Printed Wiring Boards" had the following objectives:

• Evaluate the performance of small diameter PTHs under controlled environmental conditlons.

• Evaluate the influence of the thickness and quality of deposited copper on PTH performance.

• Determlne the impact of varying PTH aspect ratios.

• Collect data on the influence of product design or manufacturing methods.

• Determine if test results from different military and industrial thermal cycle and/or thermal shock procedures can be correlated.

Document History

IPC-TR-579
September 1, 1988
Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards
Objective The "Round Robin Reliability Evaluation of Small Diameter Plated Through Holes (PTH) in Printed Wiring Boards" had the following objectives: • Evaluate the performance of small diameter...

References

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