IPC-9631 GERMAN
Users Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation
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| Organization: | IPC |
| Publication Date: | 1 December 2010 |
| Status: | active |
| Page Count: | 24 |
Document History
IPC-9631 GERMAN
December 1, 2010
Users Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation
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