DIN EN 61189-5-2
Test methods for electrical materials, interconnection structures and assemblies - Part 5-2: Test methods for printed board assemblies: Soldering Flux (IEC 91/1070/CD:2012)
inactive
| Organization: | DIN |
| Publication Date: | 1 April 2013 |
| Status: | inactive |
| Page Count: | 83 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
November 1, 2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies (IEC 61189-5-2:2015); German version EN 61189-5-2:2015
Dieser Teil von IEC 61189 ist ein Katalog von Prüfverfahren, die methodische Verfahren und Prüfabläufe darstellen, die bei der Prüfung bestückter Leiterplatten angewandt werden können.
Dieser Teil...
DIN EN 61189-5-2
April 1, 2013
Test methods for electrical materials, interconnection structures and assemblies - Part 5-2: Test methods for printed board assemblies: Soldering Flux (IEC 91/1070/CD:2012)
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