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IEC 60286-3

Packaging of components for automatic handling – Part 3: Packaging of surface mount components on continuous tapes

inactive
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Organization: IEC
Publication Date: 1 May 2013
Status: inactive
Page Count: 82
ICS Code (Electronic components in general): 31.020
ICS Code (Mechanical structures for electronic equipment): 31.240
scope:

This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the abovementioned purposes.

This standard also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).

Document History

60286-3
November 1, 2022
Packaging of components for automatic handling – Part 3: Packaging of surface mount components on continuous tapes
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those...
IEC 60286-3
January 1, 2019
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those...
IEC 60286-3
May 1, 2013
Packaging of components for automatic handling – Part 3: Packaging of surface mount components on continuous tapes
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those...
IEC 60286-3
June 1, 2007
Packaging of components for automatic handling – Part 3: Packaging of surface mount components on continuous tapes
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps which are intended to be connected to electronic circuits. It includes only those...
IEC 60286-3
December 1, 1997
Packaging of components for automatic handling – Part 3: Packaging of surface mount components on continuous tapes
A description is not available for this item.
IEC 60286-3
February 1, 1991
Packaging of components for automatic handling Part 3: Packaging of leadless components on continuous tapes
A description is not available for this item.
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References

This document references:
IEC/TR 62258-3 - Semiconductor die products – Part 3: Recommendations for good practice in handling, packing and storage
Published by IEC on August 1, 2010
This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: – wafers, – singulated bare die, – die and wafers with attached...
This document references:
IEC 61340-5-1 - Electrostatics – Part 5-1: Protection of electronic devices from electrostatic phenomena – General requirements
Published by IEC on May 1, 2016
This part of IEC 61340 applies to activities that: manufacture, process, assemble, install, package, label, service, test, inspect, transport or otherwise handle electrical or electronic parts,...
This document references:
IEC/TR 62258-3 - Semiconductor die products – Part 3: Recommendations for good practice in handling, packing and storage
Published by IEC on August 1, 2010
This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: – wafers, – singulated bare die, – die and wafers with attached...
This document references:
ISO 11469 - Plastics - Generic identification and marking of plastics products
Published by ISO on October 1, 2016
This International Standard specifies a system of uniform marking of products that have been fabricated from plastics materials. Provision for the process or processes to be used for marking is...
This document is referenced by:
BS EN 60115-8 - Fixed resistors for use in electronic equipment Part 8: Sectional specification - Fixed surface mount resistors
Published by BSI on December 31, 2012
A description is not available for this item.
This document is referenced by:
CEI EN 60115-8 - Fixed resistors for use in electronic equipment Part 8: Sectional specification - Fixed surface mount resistors
Published by CEI on October 1, 2013
This part of EN 60115 is applicable to fixed surface mount resistors for use in electronic equipment. These resistors are typically described according to types (different geometric shapes) and...
This document is referenced by:
IEC 61760-3 - Surface mounting technology – Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
Published by IEC on February 1, 2021
This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for...
This document is referenced by:
IEC 60115-8-1 - Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G
Published by IEC on October 1, 2014
COMMENT The text of this clause may repeat information already given in some fields of the above title block. This detail specification specifies the characteristics and ratings of fixed surface...
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