Printed Boards and Printed Board Assemblies - Design and Use - Part 5-1: Attachment (Land/Joint) Considerations - Generic Requirements
|Publication Date:||1 July 2002|
|ICS Code (Electronic component assemblies):||31.190|
|ICS Code (Printed circuits and boards):||31.180|
Scope and object
This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.