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IEC 61188-5-1

Printed Boards and Printed Board Assemblies - Design and Use - Part 5-1: Attachment (Land/Joint) Considerations - Generic Requirements

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Organization: IEC
Publication Date: 1 July 2002
Status: active
Page Count: 150
ICS Code (Electronic component assemblies): 31.190
ICS Code (Printed circuits and boards): 31.180
scope:

Scope and object

This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.

Document History

IEC 61188-5-1
July 1, 2002
Printed Boards and Printed Board Assemblies - Design and Use - Part 5-1: Attachment (Land/Joint) Considerations - Generic Requirements
Scope and object This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to...

References

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