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ECIA - EIA/IS-46

Test Procedure for Resistance to Soldering (Vapor Phase Technique) for Surface Mount Devices

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Organization: ECIA
Publication Date: 1 July 1987
Status: active
Page Count: 5
scope:

There are two basic processes for soldering surface mount connectors - vapor phase and infra-red. Both apply heat which the total connector systems is exposed to with no insulating medium (e.g. printed circuit boards) between the termination and connector assembly. In addition to heat, the vapor phase system employs a chemical medium (perfluoro-carbon) in a vapor form. Connector materials are exposed to these mediums and thus must withstand both heat and chemical vapors. There are three basic features which must be evaluated prior to a material or connector configuration being acceptable for surface mount process. These factors are:

A: Heat Impact

B: Dimensional Stability

C: Chemical Resistance

This procedure establishes a technique to evaluate plastic materials used for connector housings which will be exposed to a vapor phase reflow process.

Document History

EIA/IS-46
July 1, 1987
Test Procedure for Resistance to Soldering (Vapor Phase Technique) for Surface Mount Devices
There are two basic processes for soldering surface mount connectors — vapor phase and infra-red. Both apply heat which the total connector systems is exposed to with no insulating medium (e.g....

References

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