DIN EN 61189-5-4
Test methods for electrical materials, interconnection structures and assemblies - Part 5-4: Test methods for printed board assemblies: Solder alloys and fluxed and non-fluxed solid wire (IEC 91/1072/CD:2012)
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 July 2013 |
| Status: | inactive |
| Page Count: | 30 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
DIN EN 61189-5-4
July 1, 2013
Test methods for electrical materials, interconnection structures and assemblies - Part 5-4: Test methods for printed board assemblies: Solder alloys and fluxed and non-fluxed solid wire (IEC 91/1072/CD:2012)
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