UNLIMITED FREE ACCESS TO THE WORLD'S BEST IDEAS

close
Already an Engineering360 user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your Engineering360 Experience

close
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

ECIA - 540DB00

Blank Detail Specification for Decoupling Capacitor Dual In-Line Package Sockets

inactive, Most Current
Organization: ECIA
Publication Date: 1 January 1993
Status: inactive
Page Count: 18
scope:

Decoupling Capacitor

The Decoupling Capacitor Dual In-tine Sockets of assessed quality covered by this detail specification shall have:

(a) Maximum enclosure dimensions (See Figure 1). 

(b) Working voltage not to exceed ____________ volts (rms).

(c) Current not to exceed _____ ampere per pin.

(d) Decoupling capacitance _____ microfarads

OBJECT

The object of this detail specification is to provide all information required, using Sectional Specification EIA-540D000 as a base, for the identification and quality assessment of Decoupling Capacitor Dual In-Line package sockets within the NECQ quality system. The information contained herein or by reference is complete and sufficient for inspection purposes.

Document History

540DB00
January 1, 1993
Blank Detail Specification for Decoupling Capacitor Dual In-Line Package Sockets
Decoupling Capacitor The Decoupling Capacitor Dual In-tine Sockets of assessed quality covered by this detail specification shall have: (a) Maximum enclosure dimensions (See Figure 1). ...
January 1, 1993
Blank Detail Specification for Decoupling Capacitor Dual In-Line Package Sockets
A description is not available for this item.
Advertisement