DIN EN 60191-6-13
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) (IEC 47D/834/CD:2013)
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 July 2013 |
| Status: | inactive |
| Page Count: | 34 |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
Document History
DIN EN 60191-6-13
July 1, 2013
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) (IEC 47D/834/CD:2013)
A description is not available for this item.
July 1, 2005
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top type socket for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) (IEC 47D/620/CDV:2005); German version prEN 60191-6-13:2005
A description is not available for this item.