CENELEC - EN 60286-3
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
inactive, Most Current
| Organization: | CENELEC |
| Publication Date: | 1 August 2013 |
| Status: | inactive |
| Page Count: | 44 |
| ICS Code (Electronic components in general): | 31.020 |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
scope:
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the abovementioned purposes.
This standard also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).
Document History
EN 60286-3
August 1, 2013
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those...
August 1, 2013
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those...
September 1, 2007
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
A description is not available for this item.
February 1, 1998
Packaging of Components for Automatic Handling Part 3: Packaging of Surface Mount Components on Continuous Tapes
A description is not available for this item.