UNLIMITED FREE
ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Select Your Free Newsletters

Industry Newsletters

Select Your Free Product Alerts

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

IPC-9252

Requirements for Electrical Testing of Unpopulated Printed Boards

inactive
Buy Now
Organization: IPC
Publication Date: 1 October 2012
Status: inactive
Page Count: 3

Document History

IPC-9252
September 1, 2016
Requirements for Electrical Testing of Unpopulated Printed Boards
This document is intended to assist in selecting the test analyzer, test parameters, test data, and fixturing required to perform electrical test(s) on all unpopulated printed boards. The testing of...
IPC-9252
October 1, 2012
Requirements for Electrical Testing of Unpopulated Printed Boards
A description is not available for this item.
IPC-9252
November 1, 2008
Requirements for Electrical Testing of Unpopulated Printed Boards
This document is presented to assist in selecting the test analyzer, test parameters, test data, and fixturing required to perform electrical test(s) on all unpopulated printed boards without...
IPC-9252
February 1, 2001
Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards
This document is presented to assist in selecting the test analyzer, test parameters, test data, and fixturing required to perform electrical test(s) on all unpopulated printed boards without...

References

This document references:
IPC-D-356 - Bare Substrate Electrical Test Data Format
Published by IPC on October 1, 2002
SCOPE AND OBJECTIVE This standard describes a data format for transmitting bare board electrical test information. The material contained herein is intended to convey requirements, guidelines, and...
This document references:
T-50N - Terms and Definitions for Interconnecting and Packaging Electronic Circuits
Published by IPC on November 1, 2021
This document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing...
This document references:
IPC-TM-650 2.5.7 - Dielectric Withstanding Voltage, PCB
Published by IPC on May 1, 2004
The dielectric withstanding voltage test (also called high-potential, over potential, voltage breakdown, or dielectric strength test) consists of the application of a voltage higher than rated...
This document references:
IPC-TM-650 2.5.5.7 - Characteristic Impedance of Lines on Printed Boards by TDR
Published by IPC on March 1, 2004
This document describes time domain reflectometry (TDR) methods for measuring and calculating the characteristic impedance, Z(0), of a transmission line on a printed circuit board (PCB). In TDR, a...
This document references:
IPC-D-356 - Bare Substrate Electrical Test Data Format
Published by IPC on October 1, 2002
SCOPE AND OBJECTIVE This standard describes a data format for transmitting bare board electrical test information. The material contained herein is intended to convey requirements, guidelines, and...
This document is referenced by:
7092A - Design and Assembly Process Implementation for Embedded Circuitry
Published by IPC on October 1, 2022
This document describes the design, materials and assembly challenges associated with implementing embedded circuitry into a printed board. It covers various aspects of embedded circuitry related...
This document is referenced by:
JEDEC-9703 - Mechanical Shock Test Guidelines for Solder Joint Reliability
Published by JEDEC on March 1, 2009
This document establishes mechanical shock test guidelines for assessing solder joint reliability of Printed Circuit Board (PCB) assemblies from system to component level. The three main categories...
This document is referenced by:
MIL-PRF-31032/5 - PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOPLASTIC, THERMOSETTING, OR THERMOPLASTIC AND THERMOSETTING RESIN BASE MATERIAL, WITH PLATED-THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS
Published by NPFC on May 5, 2020
Scope. This specification covers the generic performance requirements for rigid, multilayered (three or more conductor layers) printed wiring boards (hereafter designated printed board) with plated...
This document is referenced by:
MIL-PRF-31032/6C (1) - PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE SIDED, THERMOPLASTIC OR THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED-THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS
Published by DLA on September 16, 2022
Scope. This specification covers the generic performance requirements for single and double sided (one or two conductor layers) printed wiring boards (hereafter designated printed board) with or...
This document is referenced by:
IPC-6012 - Medical Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards
Published by IPC on August 1, 2020
This Specification covers qualification and performance requirements of Rigid Printed Board for Medical Device Applications. The Printed Boards may have a design that contains HDI and Design Level D...
View Less
View All
Advertisement