DIN EN 61189-3-719
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Test 3E19: Monitoring of single plated-through hole (PTH) resistance change during thermal cycling (IEC 91/1152/CD:2013)
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 April 2014 |
| Status: | inactive |
| Page Count: | 21 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
DIN EN 61189-3-719
April 1, 2014
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Test 3E19: Monitoring of single plated-through hole (PTH) resistance change during thermal cycling (IEC 91/1152/CD:2013)
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