IET - Silicon Wafer Bonding Technology for VLSI and MEMS Applications
| Organization: | IET |
| Publication Date: | 1 January 2002 |
| Page Count: | 177 |
scope:
The book covers the following topics: wafer bonding principles; polish SOI; high volume production of SOI wafer; ELTRAN technology; wafer characterisation; advanced applications; and Si on Si wafer bonding process.
Authors
A. J. Auberton-Hervé and S. S. Iyer