IET - MEMS Packaging
| Organization: | IET |
| Publication Date: | 1 January 2004 |
| Page Count: | 307 |
scope:
The book reviews developments in the following fields: fundamentals of MEMS packaging; joining and bonding technologies; sealing technology; microsystem packaging; automated microassembly; design for test; MEMS packaging in the life sciences; RF and optical packaging in telecommunications; and aerospace application.