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IPC-4101

Specification for Base Materials for Rigid and Multilayer Printed Boards

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Organization: IPC
Publication Date: 1 April 2014
Status: inactive
Page Count: 168
scope:

This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic circuits.

Document History

IPC-4101
March 1, 2017
Specification for Base Materials for Rigid and Multilayer Printed Boards
This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic...
IPC-4101
March 1, 2017
Specification for Base Materials for Rigid and Multilayer Printed Boards
This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic...
IPC-4101
April 1, 2014
Specification for Base Materials for Rigid and Multilayer Printed Boards
This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic...
IPC-4101
April 1, 2014
Specification for Base Materials for Rigid and Multilayer Printed Boards
A description is not available for this item.
IPC-4101
August 1, 2009
Specification for Base Materials for Rigid and Multilayer Printed Boards
This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic...
IPC-4101
June 1, 2006
Specification for Base Materials for Rigid and Multilayer Printed Boards
This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic...
IPC-4101
June 1, 2006
Specification for Base Materials for Rigid and Multilayer Printed Boards
A description is not available for this item.
IPC-4101
June 1, 2006
Specification for Base Materials for Rigid and Multilayer Printed Boards
This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic...
IPC-4101
December 1, 2001
Specification for Base Materials for Rigid and Multilayer Printed Boards
A description is not available for this item.
IPC-4101
December 1, 2001
Specification for Base Materials for Rigid and Multilayer Printed Boards
This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic...
IPC-4101
December 1, 1997
Specification for Base Materials for Rigid and Multilayer Printed Boards
This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic...
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References

This document references:
ASTM D5470 - Standard Test Method for Thermal Transmission Properties of Thermally Conductive Electrical Insulation Materials
Published by ASTM on November 1, 2017
This standard covers a test method for measurement of thermal impedance and calculation of an apparent thermal conductivity for thermally conductive electrical insulation materials ranging from...
This document references:
IPC-1730 - Laminator Qualification Profile
Published by IPC on June 1, 2000
This Laminator Qualification Profile (LQP) isn't intended to satisfy all of the customer's requirements, however conscientious maintenance of this document and/or registration to ISO 9000...
This document references:
IPC-4110 - Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards
Published by IPC on August 1, 1998
This specification covers paper made from cellulosic fibers intended as a reinforcing material in laminated plastics for electrical and electronic use. Purpose This specification determines the...
This document references:
IPC-4121 - Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications
Published by IPC on January 1, 2000
Purpose This specification defines guidelines for selecting core constructions in terms of fiberglass fabric style and configuration for use in multilayer PWB applications. Each core construction is...
This document references:
IPC-4130 - Specification and Characterization Methods for Nonwoven "E" Glass Mat
Published by IPC on September 1, 1998
This specification covers mat made from nonwoven ‘‘E'' glass fibers intended as a reinforcing material in laminated plastics for electrical and electronic use. Purpose This specification determines...
This document is referenced by:
IEC PAS 61249-8-1 - Qualification and performance of electrical insulating compound for printed wiring assemblies
Published by IEC on June 1, 2014
This standard establishes qualification and conformance requirements for electrical insulating compounds (conformal coatings). It has been designed and constructed with the intent of obtaining...
This document is referenced by:
IEC PAS 61182-12 - Generic requirements for printed board assembly products manufacturing description data and transfer methodology
Published by IEC on August 1, 2014
This standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling,...
This document is referenced by:
EN 16602-70-11 - Space product assurance - Procurement of printed circuit boards
Published by CEN on January 1, 2015
This Standard defines the requirements imposed on the customer, the supplier and the qualified PCB manufacturer for PCB procurement. The requirements of clause 7 apply to both qualification and...
This document is referenced by:
7092A - Design and Assembly Process Implementation for Embedded Circuitry
Published by IPC on October 1, 2022
This document describes the design, materials and assembly challenges associated with implementing embedded circuitry into a printed board. It covers various aspects of embedded circuitry related...
This document is referenced by:
EN 16602-70-10 - Space product assurance - Qualification of printed circuit boards
Published by CEN on January 1, 2015
This Standard defines the requirements for evaluation, qualification and maintenance of qualification of PCB manufacturers for different types of PCBs. This Standard is applicable to the following...
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