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JSA - JIS Z 3284-1

Solder paste - Part 1: Kinds and quality classification

active, Most Current
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Organization: JSA
Publication Date: 20 June 2014
Status: active
ICS Code (Brazing and soldering): 25.160.50

Document History

JIS Z 3284-1
January 22, 2024
Solder paste -- Part 1: Kinds and quality classification
A description is not available for this item.
JIS Z 3284-1
March 23, 2020
Solder paste -- Part 1: Kinds and quality classification (Amendment 1)
A description is not available for this item.
JIS Z 3284-1
June 20, 2014
Solder paste - Part 1: Kinds and quality classification
A description is not available for this item.

References

This document references:
JIS Z 3284-4 - Solder paste - Part 4: Test methods for wettability, solderball and spread
Published by JSA on June 20, 2014
A description is not available for this item.
This document references:
JIS Z 3284-2 - Solder paste - Part 2: Test methods for solder particle shape, surface condition judgment, and particle size distribution
Published by JSA on June 20, 2014
A description is not available for this item.
This document references:
JIS Z 3284-3 - Solder paste - Part 3: Test methods for printability, viscosity, slump and tackiness
Published by JSA on June 20, 2014
A description is not available for this item.
This document references:
JIS Z 3001-1 - Welding and allied processes - Vocabulary - Part 1: General
Published by JSA on February 20, 2018
A description is not available for this item.
This document references:
JIS Z 3001-2 - Welding and allied processes - Vocabulary - Part 2: Welding processes
Published by JSA on February 20, 2018
A description is not available for this item.
This document references:
JIS Z 3001-3 - Welding and allied processes - Vocabulary - Part 3: Soldering and brazing
Published by JSA on March 20, 2008
A description is not available for this item.
This document references:
JIS Z 3001-4 - Welding and allied processes - Vocabulary - Part 4: Imperfections in welding
Published by JSA on July 22, 2013
A description is not available for this item.
This document references:
JIS Z 3001-5 - Welding and allied processes - Vocabulary - Part 5: Laser welding
Published by JSA on July 22, 2013
A description is not available for this item.
This document references:
JIS Z 3284-4 - Solder paste - Part 4: Test methods for wettability, solderball and spread
Published by JSA on June 20, 2014
A description is not available for this item.
This document references:
JIS Z 3284-2 - Solder paste - Part 2: Test methods for solder particle shape, surface condition judgment, and particle size distribution
Published by JSA on June 20, 2014
A description is not available for this item.
This document references:
JIS Z 3284-3 - Solder paste - Part 3: Test methods for printability, viscosity, slump and tackiness
Published by JSA on June 20, 2014
A description is not available for this item.
This document is referenced by:
JIS C 61191-1 - Printed board assemblies -- Part 1: Generic specification -- Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Published by JSA on February 22, 2021
A description is not available for this item.
This document is referenced by:
JIS Z 3282 - Soft Solders - Chemical Compositions and Forms
Published by JSA on March 21, 2017
A description is not available for this item.
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