ARMY - A-A-56022
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
inactive
| Organization: | ARMY |
| Publication Date: | 19 October 1992 |
| Status: | inactive |
| Page Count: | 4 |
scope:
This commercial item description covers a silicone and/or non-silicone heat sink compound which is applied to the base and mounting studs of transistors and diodes to provide a positive heat sink seal and improve thermal conductivity at heat sink junctions.
Document History
May 20, 1994
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
A description is not available for this item.
A-A-56022
October 19, 1992
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
This commercial item description covers a silicone and/or non-silicone heat sink compound which is applied to the base and mounting studs of transistors and diodes to provide a positive heat sink...