scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 MAX697 Microprocessor watchdog/battery switchover/reset generator

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_CC) - - - - - - - - - - - −0.3 V dc to +6.0 V dc All other inputs - - - - - - - - - - - - - - - - −0.3 V dc to (V_OUT + 0.5 V) Input current V_CC - - - - - - - - - - - - - - - - - - - - - - +200 mA GND - - - - - - - - - - - - - - - - - - - - - - +20 mA Output current V_OUT - - - - - - - - - - - - - - - - - - - - - Short circuit protected All other outputs - - - - - - - - - - - - - - - +20 mA Rate-of-rise, V_CC - - - - - - - - - - - - - - - +100 V/µs Storage temperature range - - - - - - - - - - - - −65°C to +160°C Power dissipation (P_D) 2/ - - - - - - - - - - - - 600 mW Lead temperature (soldering, 10 seconds)- - - - - +300°C Thermal resistance, junction-to-case (θ_JC)- - - - +50°C/W Thermal resistance, junction-to-ambient (θ_JA) - - +100°C/W

Supply voltage (V_CC) - - - - - - - - - - - - - - 3.0 V dc to 5.5 V dc Ambient operating temperature range (T_A) - - - - −55°C to +125°C

intended Use: