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BSI - BS EN 61189-2

Test Methods for Electrical Materials, Printed Boards and Other Interconnection Structures and Assemblies - Part 2: Test Methods for Materials for Interconnection Structures

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Organization: BSI
Publication Date: 15 September 1997
Status: inactive
Page Count: 128
ICS Code (Electronic component assemblies): 31.190
ICS Code (Printed circuits and boards): 31.180

Document History

November 30, 2006
Test Methods for Electrical Materials, Printed Boards and Other Interconnection Structures and Assemblies - Part 2: Test Methods for Materials for Interconnection Structures
A description is not available for this item.
September 15, 1997
Test Methods for Electrical Materials, Printed Boards and Other Interconnection Structures and Assemblies Part 2: Test Methods for Materials for Interconnection Structures
A description is not available for this item.
BS EN 61189-2
September 15, 1997
Test Methods for Electrical Materials, Printed Boards and Other Interconnection Structures and Assemblies - Part 2: Test Methods for Materials for Interconnection Structures
A description is not available for this item.
September 15, 1997
Test Methods for Electrical Materials, Interconnection Structures and Assemblies Part 2: Test Methods for Materials for Interconnection Structures
A description is not available for this item.

References

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