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IPC - TM-650 2.3.28A

Ionic Analysis of Circuit Boards, Ion Chromatography Method

inactive
Organization: IPC
Publication Date: 1 May 2004
Status: inactive
Page Count: 2
scope:

This test procedure is designed to measure the level of anionic (including weak organic acid anions) and cationic contamination on the surface of circuit boards and circuit board assemblies by ion chromatography.

 

Document History

IPC-TM-650 2.3.28
November 1, 2012
Ionic Analysis of Circuit Boards, Ion Chromatography Method
A description is not available for this item.
TM-650 2.3.28A
May 1, 2004
Ionic Analysis of Circuit Boards, Ion Chromatography Method
This test procedure is designed to measure the level of anionic (including weak organic acid anions) and cationic contamination on the surface of circuit boards and circuit board assemblies by ion...
TM-650 2.3.28
January 1, 1995
Ionic Analysis of Circuit Boards Ion Chromatography Method
A description is not available for this item.

References

This document references:
IPC-5701 - Users Guide for Cleanliness of Unpopulated Printed Boards
Published by IPC on July 1, 2003
If you are in the electronics industry, at one time you have, will, or should wrestle with the issue of the cleanliness of the unpopulated printed circuit boards (bare boards). Residues on circuit...
This document references:
IPC-TR-583 - An In-Depth Look At Ionic Cleanliness Testing
Published by IPC on July 1, 2002
INTRODUCTION Many printed wiring assembly (PWA) failures that occur in the field can be attributed to manufacturing residue that were not properly removed. It is essential that the cleaning process...
This document is referenced by:
IPC-TR-582 - Cleaning and Cleanliness Testing Program Test Results for: Phase 3 - Low Solids Fluxes and Pastes Processed in Ambient Air
Published by IPC on November 1, 1994
INTRODUCTION Chlorofluorocarbon (CFC) compounds have been identified as agents contributing to the reduction of stratospheric ozone. In 1986, many nations of the world signed and ratified the...
This document is referenced by:
IPC-5703 - Cleanliness Guidelines for Printed Board Fabricators
Published by IPC on May 1, 2013
Introduction In many IPC standards development meetings, those individuals responsible for assessing the quality of incoming unpopulated printed boards have lamented the fact that bare printed board...
This document is referenced by:
IPC-HDBK-830 - Guidelines for Design, Selection and Application of Conformal Coatings
Published by IPC on August 1, 2013
Conformal coating, for the purpose of this document, is defined as a thin, transparent, polymeric coating that is applied to the surfaces of PCAs to provide protection from the end-use environment....
This document is referenced by:
BS EN IEC 61191-1 - Printed Board Assemblies Part 1: Generic Specification - Requirements for Soldered Electrical and Electronic Assemblies Using Surface Mount and Related Assembly Technologies
Published by BSI on November 30, 2018
A description is not available for this item.
This document is referenced by:
J-STD-001 - Automotive Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610G Acceptability of Electronic Assemblies
Published by IPC on February 1, 2020
This Addendum provides requirements to be used in addition to, and in some cases, in place of, those published in J-STD-001G and IPC-A-610G to ensure the reliability of mission-critical soldered...
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