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IPC - TM-650 2.1.1.1

Microsectioning, Ceramic Substrate

inactive, Most Current
Organization: IPC
Publication Date: 1 December 1987
Status: inactive
Page Count: 2
scope:

This procedure describes the preparation of metallographic specimens containing ceramic components mounted on printed wiring boards or ceramic substrates. This procedure must be carefully followed to minimize ceramic chunking and to maintain a flat surface.

Document History

TM-650 2.1.1.1
December 1, 1987
Microsectioning, Ceramic Substrate
This procedure describes the preparation of metallographic specimens containing ceramic components mounted on printed wiring boards or ceramic substrates. This procedure must be carefully followed to...

References

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