scope:

General

Fuse-links for the protection of semiconductor devices according to the following sections shall comply with all subclauses of

• IEC 60269-1: Low-voltage fuses - Part 1: General requirements; and

• IEC 60269-4: Low-voltage fuses - Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices

and shall comply with the requirements laid down in the relevant sections.

This standard is divided into three sections, each dealing with specific examples of standardized dimensions.

Section I: Fuse-links having bolted connections

Type A

Type B

Type C

Section II: Fuse-links with flush end connections

Type A

Type B

Section III: Fuse-links with cylindrical contact caps

Type A

This standard covers dimensional systems but does not standardize characteristics.

Fuse-links for the protection of semiconductor devices may also have the same dimensions as fuse-links to:

IEC 60269-2-1: Section I

IEC 60269-2-1: Section III

IEC 60269-3-1: Section I

In addition to meeting the requirements of IEC 60269-4, the power dissipation of the fuse-link shall not exceed the power acceptance of the associated fuse bases or fuseholders. Where the power dissipation of the fuse-link exceeds the power acceptance of the standardized fuse base or fuseholder, de-rating values shall be given by the manufacturer.