scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.21 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device type shall identify the circuit function as follow:

Device type Generic number Circuit function 01 AD567 12-bit, current output D/A converter, microprocessor compatible.

The case outline shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline X D-10, (28-lead, 1.490" × .610" × .232"), dual-in-line package.

V_CC to POWER GROUND - - - - - - - - - - - - - - - - - - - 0 V dc to +18 V dc V_EE to POWER GROUND - - - - - - - - - - - - - - - - - - - 0 V dc to −18 V dc Voltage on DAC OUT (pin 2) - - - - - - - - - - - - - - - - −3 V dc to +12 V dc Digital inputs (pins 10-15, 17-28) to POWER GROUND - - - −1.0 V dc to 7.0 V dc V_REF IN to REF GND - - - - - - - - - - - - - - - - - - - ±12 V dc BIP OFFSET to REF GND - - - - - - - - - - - - - - - - - - ±12 V dc 10 V SPAN R to REF GND - - - - - - - - - - - - - - - - - ±12 V dc 20 V SPAN R to REF GND - - - - - - - - - - - - - - - - - ±24 V dc V_REF OUT short, to POWER GROUND - - - - - - - - - - - - - Continuous Power dissipation (P_D) - - - - - - - - - - - - - - - - - 1,000 mW Storage temperature range - - - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds) - - - - - - - - +300°C Thermal resistance, junction to case (θ_JC) - - - - - - - See MIL-M-38510, appendix C Thermal resistance, junction to ambient (θ_JA) - - - - - - 60°C/W

Supply voltage, V_CC - - - - - - - - - - - - - - - - - - - +15 V dc Supply voltage, V_EE - - - - - - - - - - - - - - - - - - - −15 V dc Ambient operating temperature range (T_A) - - - - - - - - −55°C to +125°C

intended Use: