scope:

FOREWORD

This revision of MIL-HDBK-217 is based upon recently completed study contracts and provides changes to the following sections:

Discrete Semiconductors

Resistors

Capacitors

Inductive Devices

Rotating Devices (Motors)

Relays

Switches

Connectors

Connections

Other changes include the addition of new airborne environments for all sections of the Handbook to show the effects of equipment installation on long mission aircraft (transports and bombers) and on high performance aircraft (fighters and interceptors). Changes made since the issuance of Notice 2 dated 17 March 1978 are shown with an asterisk in the Table of Contents. This was done as a convenience only and the Government assumes no 1iability whatsoever for any inaccuracies in these notations. Bidders and contractors are cautioned to evaluate the requirements of this document based upon the entire content irrespective of these notations and relationship to the superseded pages.

As in the earlier version of the Handbook, two prediction procedures, part stress analysis and part count, are provided as well as equations for the model variables for use in computer programming of the prediction procedure. These prediction procedures will be continually updated as new information becomes available. Work is now underway to develop reliability models for new parts which will be added to the Handbook when completed.

The Handbook is oriented toward reliability prediction of military electronic equipment; it provides a common basis for predicting and comparing predictions on military proposals and contracts.