scope:

This standard covers the process and materials for selective electrodeposition of various metals and alloys on ferrous alloys, aluminum alloys, copper alloys, nickel alloys and corrosion-resistant steel, etc.

The selective plating process (sometimes called "brush" plating) is a method of depositing metal from concentrated electrolyte solutions on selected areas without immersion tanks. In this process, metal is deposited from an electrolyte held in an absorbent material attached to an inert anode. Plating contact is made by brushing or swabbing the part (cathode) to be plated with the electrolyte-bearing anode.

a. To prevent or minimize disassembly costs.

b. To minimize machining costs (plate to size).

c. To minimize masking costs.

d. To develop field capability.

e. To plate small areas of extremely large parts.

f. To supplement conventional plating.

g. To plate high strength steels.

h. To plate onto difficult to plate metals, i.e., Aluminum, Molybdenum, Titanium, etc., either as a bonding agent or for subsequent finishing.

i. To restore worn, corroded, or overmachined parts back to size.

Because of the growing demand and limited availability of electronic components, there has been a significant increase in the need for an approved repair process for salvage of damaged or defective printed circuit boards. Techniques have been developed utilizing selective plating for repair of these boards. These techniques are available through the manufacturer of the selective plating solutions. The specific types of repairs that can be accomplished are:

a. Repair of defective plating.

b. Repair of damaged contacts (fingers) due to peeling.

c. Repair of lifted, damaged, or missing pads and traces.

d. Adding new circuitry or rerouting traces on existing circuit boards.

e. Repairing breaks in continuity.

f. Repairs of damaged plating in through holes.