scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Propagation Delay 01 L29C520 4 × 8-bit multilevel pipeline register 30 ns 02 L29C520 4 × 8-bit multilevel pipeline register 24 ns 03 L29C520 4 × 8-bit multilevel pipeline register 16 ns 04 L29C521 4 × 8-bit multilevel pipeline register 30 ns 05 L29C521 4 × 8-bit multilevel pipeline register 24 ns 06 L29C521 4 × 8-bit multilevel pipeline register 16 ns

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

For device classes M, B, and S, case outline(s) shall meet the requirements in appendix C of MIL-M-38510 and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of MIL-I-38535, appendix C of MIL-M-38510, and as listed below.

Outline letter Case outline L D-9 (24-lead, 1.280" × .310" × .200"), dual-in-line package 3 C-4 (28-terminal, .460" × .460" × .100" maximum), square leadless chip carrier package K F-6 (24-lead, .640" × .420" × .090"), flat pack

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Storage temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to +150°C Operating ambient temperature . . . . . . . . . . . . . . . . . . . . . . . . −55°C to +125°C V_CC supply voltage with respect to ground . . . . . . . . . . . . . . . . . . −0.5 V to +7.0 V Input signal with respect to ground . . . . . . . . . . . . . . . . . . . . . −3.0 V to +7.0 V Signal applied to high impedance output . . . . . . . . . . . . . . . . . . . −3.0 V to +7.0 V Output current into low outputs . . . . . . . . . . . . . . . . . . . . . . . 25 mA Latchup current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . > 200 mA Thermal resistance, junction-to-case (Θ_JC). . . . . . . . . . . . . . . . . . See MIL-M-38510, appendix C Power dissipation (P_D) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250 mW Junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175°C Lead temperature (soldering, 10 seconds). . . . . . . . . . . . . . . . . . . +275°C

Supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.50 V ≤ V_CC ≤ 5.50 V Operating case temperature (T_C) . . . . . . . . . . . . . . . . . . . . . . . . −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . . . . . . . . . . . . XX percent 2/

intended Use: