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IPC - TM-650 2.3.34.1B

Percentage of Flux on/in Flux-Coated and/or Flux-Cored Solder

active, Most Current
Organization: IPC
Publication Date: 1 January 1995
Status: active
Page Count: 1
scope:

This test method provides a measurement of the flux percentage on flux-coated and/or in flux-cored solder.

Document History

TM-650 2.3.34.1B
January 1, 1995
Percentage of Flux on/in Flux-Coated and/or Flux-Cored Solder
This test method provides a measurement of the flux percentage on flux-coated and/or in flux-cored solder.
TM-650 2.3.34.1
January 1, 1995
Percentage of Flux on/in Flux-Coated and/or Flux-Cored Solder
A description is not available for this item.

References

This document references:
J-STD-006 - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications Amendment 1
Published by IPC on October 1, 2017
A description is not available for this item.
This document references:
J-STD-006 - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications Amendment 1
Published by IPC on October 1, 2017
A description is not available for this item.
This document is referenced by:
J-STD-006 CHINESE - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
Published by IPC on July 1, 2013
A description is not available for this item.
This document is referenced by:
J-STD-006 JAPANESE - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
Published by IPC on July 1, 2013
A description is not available for this item.
This document is referenced by:
MIL-PRF-55110 - PRINTED WIRING BOARD, RIGID, GENERAL SPECIFICATION FOR
Published by NPFC on May 16, 2020
Scope. This specification establishes the performance and qualification requirements for rigid single-sided, double-sided, and multilayered printed wiring boards with or without plated through holes...
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