Standard Test Method for Embedment Stress Caused by Casting Compounds on Glass-Encased Electronic Components
|Publication Date:||27 August 1976|
1.1 This test method covers measurements of stress created by the chemical and thermal shrinkage of casting compounds. The usefulness has been demonstrated at all pressures up to 6000 psi (40 MPa) but the maximum limit of usefulness has not been determined. Measurements can be made from −40°F (−40°C) to 220°F (105°C). This test simulates the pressure exerted on glass-encased electronic components when embedded in casting compounds. This test method is also usable for determining the effect of a flexible conformal coating used to protect parts from the shrinkage of casting compounds.
1.2 This standard does not purport to address all of the safety problems, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
1.3 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.