DLA - SMD-5962-94686
MICROCIRCUIT, LINEAR, A/D CONVERTER, 12-BIT, 5 MSPS, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 25 July 1994 |
| Status: | inactive |
| Page Count: | 13 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 AD871SD 12-Bit A/D Converter 02 AD871SE 12-Bit A/D Converter
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style X GDIP1-T28 or CDIP2-T28 28 Dual-in-line Y CQCC1-N44 44 Square leadless chip carrier
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
AVDD to AGND . . . . . . . . . . . . . . . . . . . −0.5 V to +6.5 V AVSS to AGND . . . . . . . . . . . . . . . . . . . −6.5 V to +0.5 V DVDD, DRVDD to DGND, DRGND 2/ . . . . . . . . . . −0.5 V to +6.5 V DRVDD to DVDD 2/ . . . . . . . . . . . . . . . . . −6.5 V to +6.5 V DRGND to DGND 2/ . . . . . . . . . . . . . . . . . −0.3 V to +0.3 V AGND to DGND . . . . . . . . . . . . . . . . . . . −1 V to +1 V AVDD to DVDD . . . . . . . . . . . . . . . . . . . −6.5 V to +6.5 V Clock input, OEN to DGND 2/ . . . . . . . . . . . −0.5 V to DVDD + 0.5 V Digital outputs to DGND . . . . . . . . . . . . . −0.5 V to DVDD + 0.3 V REFIN to AGND . . . . . . . . . . . . . . . . . . AVSS to AVDD VINA, VINB, REFIN to AGND . . . . . . . . . . . . −6.5 V to +6.5 V Power Dissipation (PD) . . . . . . . . . . . . . . 1.3 W Thermal Resistance, junction-to-case (θJC) . . . . See MIL-STD-1835 Thermal Resistance, junction-to-ambient (θJA): Case outline X . . . . . . . . . . . . . . . . . 60°C/W Case outline Y . . . . . . . . . . . . . . . . . 70°C/W Storage Temperature Range . . . . . . . . . . . . −65°C to 150°C Lead Temperature (Soldering 10 sec) . . . . . . . +300°C
Operating Temperature Range (TA) . . . . . . . . . −55°C to 125°C
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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