DLA - SMD-5962-93253 REV A
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, QUAD BUFFER WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 22 December 1994 |
| Status: | inactive |
| Page Count: | 22 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device classes M, B, and S RHA marked devices shall meet the MIL-I-38535, Appendix A, specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 54AC125 Quad buffer with three-state outputs
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-I-38535, Appendix A Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835, and as follows:
Outline letter Descriptive designator Terminals Package style
C GDIP1-T14 or CDIP2-T14 14 Dual-in-line
D GDFP1-F14 or CDFP2-F14 14 Flat
2 CQCC1-N20 20 Leadless-chip-carrie
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for device class M, or MIL-I-38535, Appendix A, for device classes B and S, or MIL-I-38535 for device classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage range (VCC) - - - - - - - - - - - - - - - - - - - −0.5 V dc to +6.0 V dc DC input voltage range (VIN) - - - - - - - - - - - - - - - - - - −0.5 V dc to VCC + 0.5 V dc DC output voltage range (VOUT)- - - - - - - - - - - - - - - - - - −0.5 V dc to VCC + 0.5 V dc DC input diode current (IIK) (VIN = −0.5V to VCC + 0.5 V) - - - - ±20 mA DC output diode current (IOK) (VOUT = −0.5V to VCC + 0.5 V) - - - ±20 mA DC output current (IOUT)- - - - - - - - - - - - - - - - - - - - - ±50 mA DC VCC or GND current (ICC, IGND) - - - - - - - - - - - - - - - - ±50 mA times the number of outputs Storage temperature range (TSTG)- - - - - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (PD)- - - - - - - - - - - - - - - - - - 500 mW Lead temperature (soldering, 10 seconds) - - - - - - - - - - - - +300°C Thermal resistance, junction-to-case (ΘJC)- - - - - - - - - - - - See MIL-M-1835 Junction temperature (TJ) - - - - - - - - - - - - - - - - - - - - +175°C
Supply voltage range (VCC) - - - - - - - - - - - - - - - - - - - +3.0 V dc to +5.5 V dc Input voltage range (VIN) - - - - - - - - - - - - - - - - - - - +0.0 V dc to VCC Output voltage range (VOUT) - - - - - - - - - - - - - - - - - - +0.0 V dc to VCC Maximum low level input voltage (VIL)- - - - - - - - - - - - - - 0.90 V dc at VCC = 3.0 Vdc 1.08 V dc at VCC = 3.6 Vdc 1.35 V dc at VCC = 4.5 Vdc 1.65 V dc at VCC = 5.5 Vdc Minimum high level input voltage (VIH) - - - - - - - - - - - - - 2.10 v dc at VCC = 3.0 Vdc 2.52 V dc at VCC = 3.6 Vdc 3.15 V dc at VCC = 4.5 Vdc 3.85 V dc at VCC = 5.5 Vdc Case operating temperature range (TC)- - - - - - - - - - - - - - −55°C to +125°C Input edge rate (ΔV/Δt) minimum: (VIN from 30% to 70% of VCC) - - - - - - - - - - - - - - - - - 125 mV/ns Maximum low level output current (IOL) - - - - - - - - - - - - - 12 mA at VCC = 3.0 V and 3.6 V dc 24 mA at VCC = 4.5 V and 5.5 V dc Maximum high level output current (IOH)- - - - - - - - - - - - - −12 mA at VCC = 3.0 V and 3.6 V dc −24 mA at VCC = 4.5 V and 5.5 V dc
Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012)- - - - - - - - XX percent 5/
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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