scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Access time 01 C22V10 22-input 10-output 25 ns and-or-Logic array 02 C22V10 22-input 10-output 30 ns and-or-Logic array 03 C22V10 22-input 10-output 40 ns and-or- Logic array 04 C22V10 22-input 10-output 20 ns and-or- Logic array 05 C22V10 22-input 10-output 15 ns and-or-Logic array

The case outline(s) shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline K F-6 (24-Lead, .640" × .420" × .090"), flat package L D-9 (24-Lead, 1.280" × .310" × .200"), dual-in-line package 3 C-4 (28-terminal .460" × .460" × .100"), square chip carrier package

Supply voltage range - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc Input voltage range - - - - - - - - - - - - - - −2.0 V dc to +7.0 V dc 2/ Output voltage applied range - - - - - - - - - - −0.5 V dc to +7.0 V dc 2/ Output sink current- - - - - - - - - - - - - - - 16 mA Thermal resistance, junction-to-case (θ_JC): See MIL-M-38510, appendix C Maximum power dissipation (P_D) 3/ - - - - - - - - 1.2 W Maximum junction temperature (T_J) - - - - - - - - +175°C Lead temperature (soldering, 10 seconds maximum) - +260°C Storage temperature range - - - - - - - - - - - - - −65°C to +150°C Temperature under bias - - - - - - - - - - - - - - −55°C to +125°C

Supply voltage (V_CC) - - - - - - - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc High level input voltage (V_IH) - - - - - - - - - - - - - - 2.0 V dc minimum Low level input voltage (V_IL) - - - - - - - - - - - - - - 0.8 V dc maximum Case operating temperature range (T_C)- - - - - - - - - - - −55°C to +125°C

intended Use: