UNLIMITED FREE ACCESS TO THE WORLD'S BEST IDEAS

close
Already an Engineering360 user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your Engineering360 Experience

close
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

IEC 61189-6

Test methods for electrical materials, interconnection structures and assemblies – Part 6: Test methods for materials used in manufacturing electronic assemblies

inactive
Buy Now
Organization: IEC
Publication Date: 1 July 2006
Status: inactive
Page Count: 88
ICS Code (Printed circuits and boards): 31.180
scope:

This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to materials used in manufacturing electronic assemblies.

 

Document History

IEC 61189-6
July 1, 2006
Test methods for electrical materials, interconnection structures and assemblies – Part 6: Test methods for materials used in manufacturing electronic assemblies
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to materials used in manufacturing electronic assemblies.  

References

Advertisement