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IEC 61189-6

Test methods for electrical materials, interconnection structures and assemblies – Part 6: Test methods for materials used in manufacturing electronic assemblies

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Organization: IEC
Publication Date: 1 July 2006
Status: inactive
Page Count: 88
ICS Code (Printed circuits and boards): 31.180
scope:

This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to materials used in manufacturing electronic assemblies.

 

Document History

IEC 61189-6
July 1, 2006
Test methods for electrical materials, interconnection structures and assemblies – Part 6: Test methods for materials used in manufacturing electronic assemblies
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to materials used in manufacturing electronic assemblies.  

References

This document references:
IEC 61190-1-3 - Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solder for electronic soldering applications
Published by IEC on December 1, 2017
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic...
This document references:
IEC 61190-1-1 - Attachmant Materials for Electronic Assembly - Part 1-1: Requirements for Soldering Fluxes for High-Quality Interconnections in Electronics Assembly
Published by IEC on March 1, 2002
A description is not available for this item.
This document references:
IEC 61189-1 - Test Methods for Electrical Materials, Interconnection Structures and Assemblies - Part 1: General Test Methods and Methodology
Published by IEC on November 1, 2001
Scope and object This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection...
This document references:
ISO 9001 - Quality management systems — Requirements
Published by ISO on September 15, 2015
This International Standard specifies requirements for a quality management system when an organization: a) needs to demonstrate its ability to consistently provide products and services that meet...
This document references:
IEC 61190-1-3 - Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solder for electronic soldering applications
Published by IEC on December 1, 2017
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic...
This document is referenced by:
IEC 61189-5-4 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-4: General test methods for materials and assemblies – Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
Published by IEC on January 1, 2015
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods...
This document is referenced by:
IEC 61189-5-2 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
Published by IEC on January 1, 2015
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods...
This document is referenced by:
IEC 61189-5-3 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-3: General test methods for materials and assemblies – Soldering paste for printed board assemblies
Published by IEC on January 1, 2015
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods...
This document is referenced by:
EN 61189-5-3 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
Published by CENELEC on March 1, 2015
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods...
This document is referenced by:
EN 61189-5-4 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
Published by CENELEC on March 1, 2015
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods...
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