scope:

This specification covers the detail requirements for monolithic silicon, high speed, CMOS, latches, bistable logic microcircuits. Two product assurance classes and a choice of case outlines and lead finish are provided and are reflected in the complete part number.

The part number shall be in accordance with MIL-M-38510, and as specified herein.

The device types shall be as follows:

Device type Circuit 01 Quad, bistable, transparent latch 02 8-Bit addressable latch 03 Octal, D type latch, 3-state 04 Octal transparent latch, 3-state, inverting 05 Octal transparent latch, 3-state inverting 06 Octal transparent latch, 3-state 53 Octal D-type flip-flop, 3-state and TTL- compatible inputs

The device class shall be the product assurance level as defined in MIL-M-38510.

The case outlines shall be designated as follows:

Outline letter Case outline (see MIL-M-38510, appendix C) E D-2 (16 lead, ¼" × ¾"), dual-in-line package F F-5 (16-lead, ¼" × ⅜"), flat package R D-8 (20-lead, ¼" × 1 1/16"), dual-in-line package S F-9 (20-lead, ¼" × ½"), flat package 2 C-2 (20-terminal, .350" × .350") square chip carrier package

Supply voltage - - - - - - - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc DC-input voltage - - - - - - - - - - - - - - - - - - - −0.5 V dc to V_CC +1.5 V dc DC output voltage- - - - - - - - - - - - - - - - - - - −0.5 V dc to V_CC +1.5 V dc Clamp diode current- - - - - - - - - - - - - - - - - - ±20 mA DC current per pin - - - - - - - - - - - - - - - - - - ±25 mA (±35 mA for type 03-06, 53) DC V_CC or GND current per pin - - - - - - - - - - - - ±50 mA (±70 mA for type 03-06, 53) Storage temperature range - - - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation - - - - - - - - - - - - - - - 300mW Lead temperature (soldering, 10 seconds)- - - - - - - - +300°C Thermal resistance, junction-to-case (θ_JC): Cases E, F, R, and S- - - - - - - - - - - - - - - - - (See MIL-M-38510, appendix C) Case 2- - - - - - - - - - - - - - - - - - - - - - - - 60°C/W Junction temperature (T_J) - - - - - - - - - - - - - - +175°C

Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Rome Air Development Center (RBE-2), Griffiss AFB, NY 13441, by using the self-addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter.

Input low (V_IL) maximum voltage - - - - - - - 0.3 V at V_CC = 2 V 0.9 V at V_CC = 4.5 V 1.2 V at V_CC = 6 V Input high (V_IH) minimum voltage - - - - - - - 1.5 V at V_CC = 2 V 3.15 V at V_CC = 4.5 V 4.2 V at V_CC = 6 V Supply voltage (V_CC) - - - - - - - - - - - - - 2 V dc to 6 V dc Input voltage - - - - - - - - - - - - - - - - - 0 V dc to V_CC Operating temperature - - - - - - - - - - - - - −55°C to +125°C Input rise and fall times (t_r, t_f) maximum: V_CC = 2.0 V 1000 ns V_CC = 4.5 V 500 ns V_CC = 6.0 V 400 ns Device 53 Input low (V_IL) maximum voltage - - - - - - - - 0.8 V at V_CC = 4.5 to 5.5 V dc Input high (V_IH) minimum voltage - - - - - - - - 2.0 V at V_CC = 4.5 to 5.5 V dc Supply voltage (V_CC) - - - - - - - - - - - - - - 4.5 V to 5.5 V dc Output voltage - - - - - - - - - - - - - - - - - 0 V dc to V_CC Operating temperature - - - - - - - - - - - - - - −55°C to +125°C Input rise and fall times (t_r, t_f) at V_CC = 4.5 V: - - - - - - - - - - - - - - - - 500 ns max Width of clock pulse (t_p clock) (V_CC = 4.5 V minimum): Devices 01, 02, 05, 06, - - - - - - - - - - - 24 ns minimum Devices 03, 04, 53- - - - - - - - - - - - - - 30 ns minimum Device 02 reset - - - - - - - - - - - - - - - 24 ns minimum Data setup time before clock (t_setup): (V_CC = 4.5 V minimum): Devices 01-04, 53 - - - - - - - - - - - - - - 30 ns minimum Devices 05, 06- - - - - - - - - - - - - - - - 23 ns minimum t_HOLD: (V_CC = 4.5 V minimum): Device types 01, 02 - - - - - - - - - - - - - 8 ns minimum Device types 03-06, 53- - - - - - - - - - - - 15 ns minimum

intended Use:

Microcircuits conforming to this specification are intended for original equipment design application and logistic support of existing equipment.