scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 VACO68A VNEbus address controller

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals package style X CMGA7-P145 145 Pin grid array Y See figure 1 160 Flat pack

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Storage temperature range - - - - - - - - - - - - - - - - −65°C to +150°C Voltage on any pin with respect to ground - - - - - - - - −0.5 V dc to +7.0 V dc Power dissipation (P_D) - - - - - - - - - - - - - - - - - - 1.5 W Lead temperature (soldering, 10 seconds) - - - - - - - - - +260°C Thermal resistance, junction-to-case (Θ_JC) Case outline X - - - - - - - - - - - - - - - - - - - - - See MIL-STD-1835 Case outline Y - - - - - - - - - - - - - - - - - - - - - 10 °C/W Junction temperature (T_J)- - - - - - - - - - - - - - - - - +175°C

Case operating temperature range (T_C) - - - - - - - - - - −55°C to +125°C Supply voltage (V_CC) - - - - - - - - - - - - - - - - - - - 5.0 V dc ±10%

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . . . XX percent 2/

intended Use: