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IPC - TM-650 2.4.41.2

Coefficient of Thermal Expansion-Strain Gage Method

inactive
Organization: IPC
Publication Date: 1 August 1997
Status: inactive
Page Count: 4

Document History

May 1, 2004
Coefficient of Thermal Expansion-Strain Gage Method
To describe the strain gage method for determining linear thermal expansion of laminated materials within the temperature range of −55 °C to +130 °C and inorganic substrates (nonlaminated) with a...
TM-650 2.4.41.2
August 1, 1997
Coefficient of Thermal Expansion-Strain Gage Method
A description is not available for this item.
June 1, 1991
Coefficient of Thermal Expansion - Strain Gage Method
A description is not available for this item.
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