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BSI - BS EN 62025-2

High frequency inductive components Non-electrical characteristics and measuring methods Part 2: Test methods for non-electrical characteristics

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Organization: BSI
Publication Date: 5 April 2005
Status: inactive
Page Count: 28
ICS Code (Magnetic components): 29.100.10

Document History

BS EN IEC 62025-2
November 30, 2019
High frequency inductive components — Non-electrical characteristics and measuring methods Part 2: Test methods for non-electrical characteristics
A description is not available for this item.
BS EN 62025-2
April 5, 2005
High frequency inductive components Non-electrical characteristics and measuring methods Part 2: Test methods for non-electrical characteristics
A description is not available for this item.

References

This document references:
IEC 60068-2-58 - Environmental testing – Part 2-58: Tests – Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Published by IEC on July 1, 2017
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD) This document provides procedures for determining the solderability, resistance to dissolution of metallization...
This document references:
IEC 60068-2-6 - Environmental testing – Part 2-6: Tests – Test Fc: Vibration (sinusoidal)
Published by IEC on December 1, 2007
This part of IEC 68 gives a method of test which provides a standard procedure to determine the ability of components, equipment and other articles, hereinafter referred to as specimens, to withstand...
This document references:
IEC 60068-2-27 - Environmental testing – Part 2-27: Tests – Test Ea and guidance: Shock
Published by IEC on February 1, 2008
Object To provide a standard procedure for determining the ability of a specimen to withstand specified severities of shock.
This document references:
IEC 60068-2-69 - Environmental testing – Part 2-69: Tests – Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
Published by IEC on June 1, 2019
This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations....
This document is referenced by:
BS EN 62674-1 - High Frequency Inductive Components - Fixed surface mount inductors for use in electronic and telecommunication equipment
Published by BSI on January 31, 2013
A description is not available for this item.
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