DS/EN 29453
Soft solder alloys - Chemical compositions and forms
inactive, Most Current
| Organization: | DS |
| Publication Date: | 12 March 1997 |
| Status: | inactive |
| Page Count: | 22 |
| ICS Code (Brazing and soldering): | 25.160.50 |
scope:
This standard specifies the requirements for chemical composition for the following families of soft solder alloys: tin-lead, with and without antimony; tin-silver, with and without lead; tin-copper, with and without lead; tin-antimony; tin-lead-bismuth; bismuth-tin; tin-lead-cadmium; tin-indium; lead-silver, with and without tin. An indication of the forms generally available is also included.
Document History
DS/EN 29453
March 12, 1997
Soft solder alloys - Chemical compositions and forms
This standard specifies the requirements for chemical composition for the following families of soft solder alloys: tin-lead, with and without antimony; tin-silver, with and without lead; tin-copper,...
References
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