IPC - TM-650 5.1.100
Analysis of Copper Fluoborate Electroplating Solutions
inactive, Most Current
| Organization: | IPC |
| Publication Date: | 1 April 1975 |
| Status: | inactive |
| Page Count: | 2 |
scope:
This test method is used to determine the major constituents in copper fluoborate electroplating solutions.
Document History
TM-650 5.1.100
April 1, 1975
Analysis of Copper Fluoborate Electroplating Solutions
This test method is used to determine the major constituents in copper fluoborate electroplating solutions.