scope:

This drawing documents five product assurance classes, class D (lowest reliability), class E, (exceptions), class G (lowest high reliability), class H (high reliability), and class K, (highest reliability) and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes H and K RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 AD10242 Dual, 12-bit, 40 MSPS, MCM, analog to digital converter

This device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device Performance documentation D, E, G, H or K Certification and qualification to MIL-PRF-38534

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X See figure 1 68 Leaded ceramic chip carrier

The lead finish shall be as specified in MIL-PRF-38534.

Positive supply voltage (V_CC) .......................... 0 V dc to +7.0 V dc Negative supply voltage (V_EE) .......................... 0 V dc to −7.0 V dc Analog input voltage ................................... −7.0 V dc to +7 V dc Analog input current ................................... −10 mA to +10 mA Digital input voltage (ENCODE) ......................... 0 V dc to +7.0 V dc ENCODE, [E bar][N bar][C bar][O bar][D bar][E bar] differential voltage .................... +4 V dc Digital output current ................................. −40 mA to +40 mA Gain and offset adjust voltage range ................... −V_EE to +V_CC Digital input voltage range ............................ +0.5 V to −V_EE Power dissipation (P_D) ................................. 2.0 W Thermal resistance junction-to-case (θ_JC) .............. 11°C/W Thermal resistance junction-to-ambient (θ_JA) ........... 30° C/W Junction temperature (T_J) ............................... +175°C Storage temperature .................................... −65°C to +150°C Lead temperature (soldering, 10 seconds) ............... +300°C

Positive supply voltage (V_CC) .......................... +4.75 V dc to +5.25 V dc Negative supply voltage (V_EE) .......................... −5.46 V dc to −4.96 V dc Ambient operating temperature range (T_A) ............... −55°C to +125°C

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.