IPC - TM-650 2.6.7.2
Thermal Shock-Rigid Printed Boards
inactive
| Organization: | IPC |
| Publication Date: | 1 July 1993 |
| Status: | inactive |
| Page Count: | 2 |
Document History
March 1, 2020
Thermal Shock, Thermal Cycle and Continuity
This method subjects unpopulated test specimens (samples) to sudden, extreme changes in temperature in order to evaluate the quality of interconnects formed during the manufacturing processes....
May 1, 2004
Thermal Shock, Continuity and Microsection, Printed Board
This method is to determine the physical endurance of printed boards to sudden changes of temperature. It is designed to expose specimens to a series of high and low temperature excursions to cause...
August 1, 1997
Thermal Shock, Continuity and Microsection, Printed Board
A description is not available for this item.
TM-650 2.6.7.2
July 1, 1993
Thermal Shock-Rigid Printed Boards
A description is not available for this item.