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IPC-6013

Qualification and Performance Specification for Flexible Printed Boards

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Organization: IPC
Publication Date: 1 November 1998
Status: inactive
Page Count: 108
scope:

This specification covers qualification and performance requirements of flexible printed wiring. The flexible printed wiring may be single-sided, double-sided, multilayer, or rigid-flex multilayer. All of these constructions may or may not include stiffeners, plated-through holes, and blindí buried vias.

Purpose

The purpose of this specification is to provide requirements for qualification and performance of flexible printed wiring.

Document History

6013EM ADD
March 1, 2022
Medical Applications Addendum to IPC-6013E Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
This addendum covers qualification and performance requirements of Flexible/Rigid-Flexible Printed Board for Medical Device Applications. The printed boards may have a design that contains HDI and...
6013E
September 1, 2021
Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
Statement of Scope This specification covers qualification and performance requirements of flexible printed boards. The flexible printed board may be single-sided, double-sided, multilayer, or...
IPC-6013
April 1, 2018
Qualification and Performance Specification for Flexible and Rigid-Flexible Printed Boards
A description is not available for this item.
IPC-6013
September 1, 2017
Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
Statement of Scope This specification covers qualification and performance requirements of flexible printed boards. The flexible printed board may be single-sided, double-sided, multilayer, or...
IPC-6013
December 1, 2013
Qualification and Performance Specification for Flexible Printed Boards
This specification covers qualification and performance requirements of flexible printed boards. The flexible printed board may be single-sided, double-sided, multilayer, or rigid-flex multilayer....
IPC-6013
June 1, 2010
Qualification and Performance Specification for Flexible Printed Boards
A description is not available for this item.
IPC-6013
January 1, 2009
Qualification and Performance Specification for Flexible Printed Boards
Statement of Scope This specification covers qualification and performance requirements of flexible printed boards (PBs). The flexible PB may be single-sided, doublesided, multilayer, or rigid-flex...
IPC-6013
November 1, 2003
Qualification and Performance Specification for Flexible Printed Boards
This specification covers qualification and performance requirements of flexible printed wiring. The flexible printed wiring may be single-sided, double-sided, multilayer, or rigid-flex multilayer....
IPC-6013
November 1, 2003
Qualification and Performance Specification for Flexible Printed Boards
This specification covers qualification and performance requirements of flexible printed wiring. The flexible printed wiring may be single-sided, double-sided, multilayer, or rigid-flex multilayer....
IPC-6013
November 1, 2003
Qualification and Performance Specification for Flexible Printed Boards
A description is not available for this item.
IPC-6013
November 3, 2000
Qualification and Performance Specification for Flexible Printed Boards
A description is not available for this item.
IPC-6013
November 1, 1998
Qualification and Performance Specification for Flexible Printed Boards
This specification covers qualification and performance requirements of flexible printed wiring. The flexible printed wiring may be single-sided, double-sided, multilayer, or rigid-flex multilayer....
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References

This document references:
ASTM B579 - Standard Specification for Electrodeposited Coatings of Tin-Lead Alloy (Solder Plate)
Published by ASTM on March 29, 1973
This specification covers the requirements for electrodeposited tin-lead coatings on fabricated articles of iron, steel, copper, and copper alloys, to protect them against corrosion (Note 1), to...
This document references:
ASTM E3 - Standard Guide for Preparation of Metallographic Specimens
Published by ASTM on May 1, 2011
The primary objective of metallographic examinations is to reveal the constituents and structure of metals and their alloys by means of a light optical or scanning electron microscope. In special...
This document references:
E345 - Standard Test Methods of Tension Testing of Metallic Foil
January 1, 2024
These test methods cover the tension testing of metallic foil at room temperature. Exception to these methods may be necessary in individual specifications or test methods for a particular material....
This document references:
E595 - Standard Test Method for Total Mass Loss and Collected Volatile Condensable Materials from Outgassing in a Vacuum Environment
May 1, 2015
This test method covers a screening technique to determine volatile content of materials when exposed to a vacuum environment. Two parameters are measured: total mass loss (TML) and collected...
This document references:
IPC-6011 - Generic Performance Specification for Printed Boards
Published by IPC on July 1, 1996
Statement of Scope This specification establishes the general requirements for printed boards and the quality and reliability assurance requirements that must be met for their acquisition. The intent...
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