scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 88914 Low skew CMOS clock driver with reset

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or 14 Dual-in-line package CDIP2-T14

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage (referenced to GND) V_CC . . . . . . . . . . −0.5 V dc to 6.0 V dc Input voltage (referenced to GND) V_I . . . . . . . . . . . −0.5 V dc to V_CC + 0.5 V dc Output voltage (referenced to GND) V_O . . . . . . . . . . . −0.5 V dc to V_CC + 0.5 V dc Output current I_O . . . . . . . . . . . . . . . . . . . . . ±75 mA Supply current, V_CC or GND . . . . . . . . . . . . . . . . ±80 mA Power dissipation . . . . . . . . . . . . . . . . . . . . 500 mW Storage temperature . . . . . . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 sec) . . . . . . . . . . . +300°C Junction temperature, Continuous . . . . . . . . . . . . . +175°C

Supply voltage (referenced to GND) V_CC . . . . . . . . . . 4.5 V dc to 5.5 V dc Input voltage (referenced to GND) V_I . . . . . . . . . . . 0 V dc to V_CC Output voltage (referenced to GND)V_O . . . . . . . . . . . 0 V dc to V_CC Case operating temperature range T_C . . . . . . . . . . . . −55°C to +125°C Input rise and fall time t_r, t_f . . . . . . . . . . . . . . 0 to 10 ns/V Minimum pulse width CP (t_W) . . . . . . . . . . . . . . . . 3.0 ns

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . XX percent 2/

intended Use: