scope:

This appendix establishes minimum requirements for microcircuit die to be supplied under the Qualified Manufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535 and the manufacturers approved QM plan for use in monolithic microcircuits, multichip modules (MCMs), hybrids, electronic modules, or devices using chip and wire designs in accordance with MIL-PRF-38534 are specified herein. Two product assurance classes consisting of military high reliability (device class Q) and space application (device Class V) are reflected in the Part or Identification Number (PIN). When available a choice of Radiation Hardiness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes Q and V RHA identified die shall meet the MIL-PRF-38535 specified RHA levels. A dash (−) indicates a non-RHA die.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 4049UB Radiation Hardened, CMOS, hex buffer/converter. 02 4049UBN Radiation Hardened, CMOS, hex buffer/converter, neutron irradiated die.

Device class Device requirements documentation Q or V Certification and qualification to the die requirements of MIL-PRF-38535.

The die details designation shall be a unique letter which designates the die's physical dimensions, bonding pad location(s) and related electrical function(s), interface materials, and other assembly related information, for each product and variant supplied to this appendix.

Die Types Figure number 01, 02 A-1

Die Types Figure number 01, 02 A-1

Die Types Figure number 01, 02 A-1

Die Types Figure number 01, 02 A-1

See paragraph 1.3 within the body of this drawing for details.

See paragraph 1.4 within the body of this drawing for details.

intended Use: