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IEC 61192-2

Workmanship requirements for soldered electronic assemblies Part 2: Surface-mount assemblies

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Organization: IEC
Publication Date: 1 March 2003
Status: inactive
Page Count: 136
ICS Code (Electronic component assemblies): 31.190
scope:

This part of IEC 61192 specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates.

It applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting. It does not include metal or ceramic-based hybrid circuits in which the conductor metallization is deposited directly on a ceramic substrate or onto a ceramic-coated metal substrate.

Document History

IEC 61192-2
March 1, 2003
Workmanship requirements for soldered electronic assemblies Part 2: Surface-mount assemblies
This part of IEC 61192 specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar...

References

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