scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 54ABT16244 16-bit buffer/driver with three-state outputs, TTL compatible inputs 02 54ABT16244 16-bit buffer/driver with three-state outputs, TTL compatible inputs

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X GDFPI-F48 48 Flat pack

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_CC) ........................................ −0.5 V dc to +7.0 V dc DC input voltage range (V_IN) ...................................... −0.5 V dc to +7.0 V dc 4/ DC output voltage range (V_OUT) .................................... −0.5 V dc to +7.0 V dc 4/ DC input clamp current (I_IK)(V_IN < 0.0 or V_IN > V_CC) .............. −18 mA DC output clamp current(I_OK)(V_OUT < 0.0 or V_OUT > V_CC) ............ −50 mA DC output current (I_OL)(per output) ............................... +96 mA Storage temperature range (T_STG) .................................. −65°C to +150°C Lead temperature (soldering, 10 seconds) .......................... +300°C Thermal resistance, junction-to-case (Θ_JC) ........................ See MIL-STD-1835 Junction temperature (T_J) ......................................... +175°C Maximum power dissipation at (P_D): Device type 01 ................................................... 598 mW 5/ Device type 02 ................................................... 753 mW 5/

Supply voltage range (V_CC) .............................................. +4.5 V dc to +5.5 V dc Input voltage range (V_IN) ............................................... +0.0 V dc to V_CC Output voltage range (V_OUT).............................................. +0.0 V dc to V_CC Maximum low level input voltage (V_IL) ................................... +0.8 V Minimum high level input voltage (V_IH) .................................. +2.0 V Case operating temperature range (T_C) ................................... −55°C to +125°C Maximum input rise and fall rate(Δt/ΔV) (outputs enabled) ............... +10 ns/V Maximum high level output current (I_OH) ................................. −24 mA Maximum low level output current (I_OL) .................................. +48 mA

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) ........................... XX percent 7/

intended Use: