scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type identifies the circuit function as follows:

Device type Generic number Circuit function 01 54ACT8999 Scan path selector with 8-bit bidirectional data bus, TTL compatible inputs

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The cases outline are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X GDIP4-T28 28 Dual-line package 3 CQCC1-N28 28 Square chip carrier

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_CC) ........................................... −0.5 V dc to +7.0 V dc DC input voltage range (V_IN) ......................................... −0.5 V dc to V_CC +0.5 V dc 4/ DC output voltage range (V_OUT) ....................................... −0.5 V dc to V_CC +0.5 V dc 4/ DC input clamp current (I_IK) (V_IN < 0.0 V or V_I > V_CC) ............... ±20 mA DC output clamp current (I_OK) (V_IN < 0.0 V or V_I > V_CC) .............. ±20 mA Continuous output current, I_O (V_O = 0 to V_CC) ........................ ±25 mA Storage temperature range (T_STG) ..................................... −65°C to +150°C Lead temperature (soldering, 10 seconds) ............................. +300°C Thermal resistance, junction-to-case (Θ_JC) ........................... See MIL-STD-1835 Junction temperature (T_J) ............................................ +175°C Maximum power dissipation (P_D) ....................................... 85 mW 5/

Supply voltage range (V_CC) ........................................... +4.5 V dc to +5.5 V dc Minimum high level input voltage (V_IH) ............................... +2.0 V Maximum low level input voltage (V_IL) ................................ +0.8 V Input voltage range (V_IN) ............................................ +0.0 V dc to V_CC Output voltage range (V_OUT) .......................................... +0.0 V dc to V_CC Maximum high level output current (I_OH): ID (1-8) ........................................................... −1.6 mA TDO, DTDO, MCO ..................................................... −8.5 mA DTMS (1-4), DCO (three-state), [D bar][T bar][R bar][S bar][T bar], DTCK ......................... −13.6 mA Maximum low level output current (I_OL): ID (1-8) ........................................................... +1.6 mA TDO, DTDO, MCO ..................................................... +8.5 mA DTMS (1-4), DCO (three-state or open drain) ........................ +13.6 mA [D bar][T bar][R bar][S bar][T bar] .............................................................. +20.4 mA DTCK ............................................................... +40.8 mA Case operating temperature range (T_C) ................................ −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) ....................... XX percent 6/

intended Use: